Ultra High Vacuum System for Continuous Evaporation of Multilayer Thin Films
نویسندگان
چکیده
منابع مشابه
Vacuum fluctuation forces between ultra-thin films
We have investigated the role of the quantum size effects in the evaluation of the force caused by electromagnetic vacuum fluctuations between ultra-thin films, using the dielectric tensor derived from the particle in a box model. Comparison with the results obtained by adopting a continuum dielectric model shows that, for film thicknesses of 1÷10 nm, the electron confinement causes changes in ...
متن کاملCharacterization of nanostructured ZnO thin films deposited through vacuum evaporation
This work presents a novel technique to deposit ZnO thin films through a metal vacuum evaporation technique using colloidal nanoparticles (average size of 30 nm), which were synthesized by our research group, as source. These thin films had a thickness between 45 and 123 nm as measured by profilometry. XRD patterns of the deposited thin films were obtained. According to the HRSEM micrographs wo...
متن کاملUltra fast processes for solvent evaporation in thin polymer films below Tg
The solvent diffusion coefficient D in a solvent-polymer system can be much larger than the ratio a/ , where a is one monomer length (about 0.5 nm) and is the dominant relaxation time measured e.g. by broadband dielectric spectroscopy [1,2]. The discrepancy can be by up to 6 orders of magnitude and more. We propose here that the solvent diffusion is dominated by path in the liquid with fast rel...
متن کاملHigh coercivity SmFeAlC thin films fabricated by multilayer sputtering
Multilayer sputtering of SmFe/C(Al) plus appropriate thermal processing has been used to fabricate SmFeC thin films with A1 substitution for Fe. It was found that the SmFeAlC thin films exhibited exceptionally high Coercivities. A coercivity of 28 kOe was realized for the thin film with structure of Ta( l000~) / lSmFe(40~~/ G(Al)(5,&)]~50/Ta(200@ with subsequent annealing at 650°C.
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: SHINKU
سال: 1964
ISSN: 0559-8516,1880-9413
DOI: 10.3131/jvsj.7.134